Apple Xserve (Early 2008) DIY Procedure for Enclosure Manual de usuario descargar pdf (Pagina 152)

Xserve (Late 2006/Early 2008) Rear ID Tab Replacement Instructions 11

Caution: Each heat sink is connected to the logic board by a small 2-pin thermal sensor 2.

cable. Lifting the heat sink too quickly can damage the cable or connector. Because of

the tight thermal bond between the processor and heat sink, be especially cautious to

initially lift the heat sink no more than one centimeter (1 cm) o the processor. Do not

pull on the cable as you lift each heat sink enough to disconnect the cable from the

logic board.

Slowly raise the heat sink o the processor just far enough that you can reach the sensor

cable connector.

Pull on the connector, not the cable, to disconnect the sensor cable from the logic board. 3.

Lift the heat sink straight up and out of the enclosure.4.

Using an alcohol wipe, clean o any thermal grease from the underside of the heat sink. Save 5.

the alcohol wipe package for later.

Note: You will need to clean o the old thermal grease from the bottom of each heat sink

and the top of each processor and apply new thermal grease to the processors when you are

reassembling the Xserve. For more information, see “Replacing the Processor Heat Sinks.””

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Apple Xserve (Early 2008) DIY Procedure for Enclosure Manual de usuario Pagina 152